Die attach adhesives in leadframe packages require a high temperature resistance for lead-free soldering processes, good electrical and thermal properties, and the possibility of low-tension curing. DELO has adapted its products to exactly meet these requirements.

Possibilities of use

  • Semiconductor leadframe products
  • Die attach with low Young’s modulus for MEMS packages
  • Die attach for organic substrates
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Adhesives, Advantages, and Application Areas
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