This new solvent-free, flow-resistant, highly viscous sealant can be applied in any geometric shape. DELO PHOTOBOND SL4165 cures by UV light or visible light in a matter of seconds without thermal influence, enabling the cured in place gasket (CIPG) process. This means that the sealant cures so quickly in the manufacturing process that it can be immediately assembled and compressed. Once this is complete, the entire assembly group can be moved down the assembly line for the next process steps.

With a compression set of 15%, DELO PHOTOBOND SL4165 has good elastic recovery – with the highly flexible material springing back after being compressed. These properties ensure reliable sealing and help manufacturers meet to the protection requirements of IP67, the dust-protection and waterproof IP rating used for smartphone classification.

Flexible production process

Because of their versatility, liquid adhesives are ideal for complex shapes. As compared to O-rings and molded gaskets, liquid sealants require fewer process steps and reduce machine set-up times. They produce fewer rejects during production and are inexpensive to store.

The production process used for this type of sealant can be easily automated, allowing any shape to be produced on one system. They are suitable for in-line quality control through fluorescent detection of potential leaks.

DELO PHOTOBOND SL4165 is a one-component sealant that is free of paint-wetting impairment substances (PWIS). It can be used in a wide range of applications that seal housings in white goods, landlines and mobile phones. It can also be used in power electronic applications in cars for high-voltage accumulators or electronic transmission control components.

Technical Specifications

• Solvent-free, flow-resistant, highly viscous     
• Good elastic recovery due to compression set of 15%
• PWIS-free