Heat-curing

DELO offers a wide range of heat-curing adhesives for the greatest possible flexibility in your individual production process.

Heat-curing adhesives can easily meet the high requirements for mechanical protection, chemical resistance and temperature resistance in the application. 

• Curing temperatures from 60 °C to 150 °C depending on the adhesive chemistry
• Stress-equalizing to high-strength products depending on customer requirements
• Very fast thermode curing possible

Dual curing

Dual curing is the manufacturing process of choice if you want to combine the advantages of light curing / light fixing with another curing method. 

Discover our DUALBOND brand products, which guarantee speed and precision even for bonding areas that are difficult to access.

• Fast light fixation for the alignment of camera components and high strength in the shadow zones due to heat curing
• Fast sealing of a sensor cavity with light and reliable shadow curing through ambient humidity without additional heat input
• Fast light fixation of magnets and safe curing in thin gaps

Moisture curing

Moisture curing is the process of choice if you want to combine simple and robust manufacturing processes with curing under ambient conditions.
Depending on the area of application and the desired mechanical properties of the bonded joint, you have the choice between several chemical adhesive systems such as silicones (DELO-GUM), MS polymers (DELO-PUR) or cyanoacrylates (DELO-CA).

• Highly flexible and high-temperature resistant sealing adhesives or coatings and potting with silicone (DELO-GUM)
• Flexible sealant bonds in silicone-free design with MS polymers
• Fast fixings, e.g. as an assembly aid, with instant curing in seconds with instant adhesive (DELO-CA)
• Light-activated, moisture-curing flexible sealing adhesives (DELO PHOTOBOND LA)
• Light-fixable, moisture-curing adhesives (DELO DUALBOND)

Anaerobic curing

Anaerobic adhesives are the ideal solution for applications requiring reliable bonding in the absence of oxygen, particularly for metal assembly and threadlocking.

Explore our DELO-ML product line, which offers excellent strength and chemical resistance for various industrial applications.

• Fast curing at room temperature when confined between close-fitting metal surfaces
• Excellent resistance to vibration, preventing loosening of threaded assemblies
• Suitable for sealing and securing threaded connections, bearings, and cylindrical parts
• High shear and tensile strength for durable metal-to-metal bonding

Two-component adhesives

Two-component adhesives and potting compounds are the right choice when easy handling and storage at room temperature as well as reliable curing without additional energy input is required. 

These adhesives cure reliably at room temperature after mixing and can optionally be accelerated by applying heat, which can also be advantageous for subsequent assembly steps.

• Easy processing of even larger quantities of adhesive per component or per time unit
• Very easy and robust handling and storage of the adhesives

Activation on the Flow

With flow-through activation, you integrate preactivation into the dosing process. The adhesive is then cured under ambient conditions. Depending on the area of application and the desired mechanical properties of the bonded joint, you have the choice between several chemical adhesive systems such as epoxies (DELO KATIOBOND & DELO PHOTOBOND), and modified urethanes (DELO PHOTOBOND), which are cured after light activation in the DELO ACTIVIS.  

• Flow-through activation and subsequent moisture curing (DELO PHOTOBOND)
• Flow-through activation and curing under ambient conditions and optional light fixation (DELO PHOTOBOND & DELO KATIOBOND)