Press releases

DELO has developed a new approach for fan-out wafer-level packaging (FOWLP). Its feasibility study shows: With the use of UV-curable molding materials instead of heat curing ones, warpage and die shift can be reduced significantly. Additionally, this leads to improvements in curing time and

The Semicon Meets Sustainability virtual conference, organized by DELO, will take place on November 5, 2024 from 8:00 to 10:15 a.m. (CET) and in a condensed format from 5:00 to 6:40 p.m. (CET). Experts from the adhesive manufacturer as well as renowned industry experts will discuss new developments

DELO has conducted in-house feasibility studies, electrically and mechanically connecting miniLED dice using directional conductive adhesives. The results show reliable bonding strength and high yields during on-light testing. With these findings, it is evident that adhesives refine miniLED display

DELO has developed a new adhesive that can be used to create  ultra-fine structures within seconds. DELO DUALBOND EG4797 thus creates new possibilities in heterogeneous integration and optical packaging applications. Able to realize unlimited freeform structures and razor-thin optical barriers, the

Voice coil motors (VCMs) have been an important part of smartphone camera assemblies over the last decade, enabling features such as image stabilization and auto focus. DELO presents DELO DUALBOND LT2221 as a universal adhesive for the over 50 bonding tasks in VCM manufacturing. Curing fully at just

DELO has introduced a new microdispensing valve. The DELO-DOT PN5 LV pneumatic jet valve is designed for dispensing low-viscosity adhesives and other media in miniaturized applications. Thanks to its compact design, it also requires very little space to install in production systems.

In the last fiscal year (ending March 31, 2024), sales at DELO significantly increased. The manufacturer of high-tech adhesives and other multifunctional materials recorded sales revenue of €229 million ($249 million). This is an increase of twelve percent compared to the previous year. South Korea

DELO has developed a new, reliable sealant adhesive for CMOS image sensors, which are often used in driver monitoring systems. Glass filters can be bonded directly to the semiconductor chip using DELO DUALBOND EG6290. The electronics-specified adhesive can be dispensed in narrow, high bondlines, can

In its continued efforts to become a trusted supplier in electric vehicle (EV) powertrain manufacturing, GROB’s PM compact rotor assembly line was specifically designed with DELO’s dual-curing process in mind, creating a turnkey manufacturing solution for automakers and Tier 1 suppliers.

DELO has recently started producing its own green electricity. The high-tech adhesives manufacturer has installed a photovoltaic system covering its roof surfaces which will power up to 30% of its electricity.

48-volt batteries can reduce vehicle carbon emissions by up to 15 percent. Bosch is known as the technology leader in this field and offers auto manufacturers a powerful and clever solution with its mild-hybrid battery. An adhesive from DELO plays a substantial role in its integration.