Press releases

EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that it is partnering with DELO, a leading manufacturer of industrial high-tech adhesives, in the area of wafer-level optics (WLO). Both companies, well-known for their leading roles in optical sensor manufacturing, are combining efforts to enable novel optical devices and applications, such as biometric authentication and facial recognition, for the industrial, automotive and consumer electronics markets utilizing EVG’s leading lens molding and nanoimprint lithography (NIL) process equipment and DELO’s advanced adhesives and resist materials.

DELO, one of the world’s leading manufacturers of industrial adhesives for automotive, consumer and industrial electronics applications, now offers a compact LED curing lamp for use in industrial applications with limited work space. The powerful DELOLUX 503 is designed to bond small surfaces, like cameras used in autonomous cars, within seconds on serial production lines.

DELO, one of the world’s leading manufacturers of industrial adhesives for automotive, consumer and industrial electronics applications, now offers a silicone-free liquid sealant that is fast curing and protects assemblies from dust, air and water. DELO PHOTOBOND SL4165 is ideal for use in the automotive, electronics and white goods industries.

GUINNESS WORLD RECORDS® title awarded for 18-ton truck lifted one meter by crane on a bonded aluminum cylinder the size of a soft drink can.

DELO, one of the world’s leading manufacturers of industrial adhesives for automotive, consumer and industrial electronics applications,

has developed light fixation two-component epoxy resins. Thanks to the hybrid chemistry of DELO-DUOPOX DB8989, users will realize faster, less complex production processes and simplified logistics.

DELO Industrial Adhesives, Mühlbauer and Impinj, Inc. (NASDAQ: PI), have announced a new milestone in the effort to achieve high-volume inlay manufacturing. The three RAIN RFID industry leaders have successfully teamed to deliver DELO MONOPOX AC6545, supporting the high-speed assembly of copper-bonded RFID chips such as the Impinj Monza 6 family on Mühlbauer high speed assembly lines.