Renewable energy sourced from wind, water and sunlight is an important, growing market. When it comes to private housing, solar cells and photovoltaics are popular to produce energy in a sustainable way. Special solar panel bonding adhesives by DELO help optimize wafering and wafer slicing, a necessary step in solar cell manufacture.
Here, two-component epoxy resins optimize efficiency by offering high thermal stability and customized separating behavior. This enables high throughput rates. In addition, these resins are suitable for high-speed diamond wire saws.
When producing thin-film cells, bonding has been replacing soldering more and more – thanks to conductive adhesives by DELO. Ordinary silicon solar panel production also relies on glues: Here, bonded silicon blocks are clamped onto the wire saw's mounting plate to slice them into wafers (wafer cutting). Adhesives have to keep the freshly-cut wafering units tightly connected to the mounting base for the entire length of the process. Afterwards, the wafers have to be separated from the mounting plate without leaving any residue, for example by bathing them in hot water. This demands for adhesives to adhere to the carrier – avoiding contamination of water and silicon alike. DELO's two-component RM compounds (ReMovables) are customized to meet the complex demands of wafering and wafer slicing, hence enabling high throughput rates in production. Find more information on DELO's website!
The increasing cost pressure on the photovoltaics market means that production processes must be optimized continuously. DELO’s two-component RM compounds (ReMovables) are precisely tailored to the high requirements in the wafering process, and therefore make possible high output rates. To prepare the cutting process, the assembly plate, the loss plate or carrier, and the silicon ingots are bonded and fixed.
Contacting of thin-film cells by conductive adhesives is a gentle conducting method and has numerous advantages over conventional methods like soldering and ultrasonic welding. The maximum curing temperature of the adhesives is +150 °C, which is significantly lower than the temperature during soldering.