Webinar: "High strength and high reliability – process advantages of heat-curing adhesives"
2019-02-19
09.00 am - 09.45 am (CET)
Dates
Webinar: "High strength and high reliability – process advantages of heat-curing adhesives"
2019-02-19
05.00 pm - 05.45 pm (CET)
Trade fairs
2019-03-20 - 2019-03-22
Booth number:
W1.1255
Shanghai New International Expo Centre | China
Trade fairs
2019-03-20 - 2019-03-21
Booth number:
B0.520
Messe München, ICM | Germany
Presentation by Noel Clarke
Topic: "Adhesives for encapsulation and interconnection of organic, printed and flexible electronics devices"
Date: March 21, 11:50 AM - 12:10 PM
Location: room 13b at the ICM
Webinar: "Heat-curing below 80°C (176 °F) – process advantages and applications"
2019-03-20
09.00 am - 09.45 am (CET)
Webinar: "Heat-curing below 80°C (176 °F) – process advantages and applications"
2019-03-20
05.00 pm - 05.45 pm (CET)
Trade fairs
2019-07-23 - 2019-07-27
Booth number:
D-154
Sao Paulo Expo | Brazil
Trade fairs
2019-11-20 - 2019-11-21
Booth number:
R30
Santa Clara Convention Center, CA | USA
