The heart and soul of RFID technology is a small chip that is capable of both storing information and transmitting data to a receiver via radio waves. A built-in antenna is necessary for communication with the reading device. This unit can then be placed on the item in question, for example as a smart label.
Flip-chip bonding has obvious advantages over chip-on-board (COB) technology when it comes to mounting unpackaged semiconductor chips on circuit boards: Where COB technology needs four steps, flip-chip bonding is done in two. Flip-chip contacting uses electrical connectors in the shape of 'contact bumps' on the semiconductor chip's active side. Microchips from manufacturers only need to be placed into the pre-applied adhesive – and cured. Compared to COB technology, manufacture saves two process steps: electrical contacting and chip encapsulation. DELO carries both die attach adhesive solutions and anisotropic, conductive glues. DELO is also in the lead when it comes to flip-chip processes in RFID applications!
Semiconductor packaging moves towards miniaturization and thinner chips. Demands are manifold, such as superb reliability, easy processing, short cycle times and various applications in smart cards. This calls for tailored adhesives! Especially when it comes to die attach adhesive solutions, products for COB technology and flip-chip bonding, DELO offers a broad range of innovative solutions. Find out more about DELO's portfolio for semiconductor packaging online!