Contacting of thin-film cells

Contacting of thin-film cells by conductive adhesives is a gentle conducting method and has numerous advantages over conventional methods like soldering and ultrasonic welding. The maximum curing temperature of the adhesives is +150 °C, which is significantly lower than the temperature during soldering.

The adhesives’ tension-equalizing properties prevent mechanical tensions and reduce micro cracks and cell failure. DELO supplies customized products for various variants of thin-film modules. 

Properties

• One-component and heat-curing
• 100 % solvent-free
• Easy handling and dispensing
• Fast curing
• Long processing time
• Reliable and permanent contacting
• Optimized for a wide variety of thin-film surfaces and structures (rigid, flexible)

Advantages

• Easy to integrate into existing production processes
• Reduction of the cycle time by single shot process option (lamination and adhesive curing in one step)
• High process reliability
• Optimized output
• Flexible material selection