Die attach adhesives in leadframe packages require a high temperature resistance for lead-free soldering processes, good electrical and thermal properties, and the possibility of low-tension curing. DELO has adapted its products to exactly meet these requirements.

Possibilities of use

  • Semiconductor leadframe products
  • Die attach with low Young’s modulus for MEMS packages
  • Die attach for organic substrates

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Reliable Protection of Components
PDF-File, 5.3 MB
Adhesives, Advantages, and Application Areas
PDF-File, 2.9 MB
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