Die attach adhesives in leadframe packages require a high temperature resistance for lead-free soldering processes, good electrical and thermal properties, and the possibility of low-tension curing. DELO has adapted its products to exactly meet these requirements.

Possibilities of use

  • Semiconductor leadframe products
  • Die attach with low Young’s modulus for MEMS packages
  • Die attach for organic substrates


Reliable Protection of Components
PDF-File, 1.0 MB
Adhesives, Advantages, and Application Areas
PDF-File, 4.7 MB