Smart card technology: The clever little chip in your pocket

Highly likely, you are carrying a drop of DELO adhesive with you at all times: Either in the form of a smart card or a chip card in check card format. When withdrawing cash or seeing your doctor: Everyday life just wouldn't be the same without smart card technology!

Communication with and without direct contact – smart card technology

A dual interface card is a  smart card that is able to exchange contact with a receiver with or without direct contact. A standard application is traditional payment with your debit or credit card: You present your card and it is put into a card reader. The card reader then enables you to key in your PIN, for example. 

A combination card offers the option to check entry rights of large numbers of clients or users, for example when entering public transport or events. To communicate valid access rights at a checkpoint, a smartcard of this kind needs a laminated, internally hidden electromagnetic coil – an antenna. Multiple layers protect this data carrier and ensures the defined position of the read/write interface.

Application examples: Opaque chip encapsulation with DELO DAM&FILL® adhesives

Opaque chip encapsulation with Dam&Fill® adhesives

UV-curing chip encapsulants are state-of-the-art in the chip card industry. A precondition for light curing is that the encapsulants transmit light. Increased safety requirements by which the chip is protected from unauthorized viewing and copying, results in the need for black encapsulants with high mechanical loading capacity. This is where UV-curing products reach their limits.

Therefore, DELO has developed DAM&FILL® encapsulants. The heat-curing adhesives are optically intransparent, provide a very high degree of mechanical protection, and are easy to process on existing encapsulation systems. DELO's DAM&FILL® compounds are absolutely opaque even in thin layers.

Advantages overview of black Dam&Fill® compounds:

  • Enables short cycle times
  • High mechanical stress values compared to conventional UV-curing encapsulants
  • Easy to integrate into existing encapsulation systems


Adhesive Excellence and Process Intelligence
PDF-File, 3.0 MB
Adhesives, Advantages, and Application Areas
PDF-File, 4.7 MB