EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that it is partnering with DELO, a leading manufacturer of industrial high-tech adhesives, in the area of wafer-level optics (WLO). Both companies, well-known for their leading roles in optical sensor manufacturing, are combining efforts to enable novel optical devices and applications, such as biometric authentication and facial recognition, for the industrial, automotive and consumer electronics markets utilizing EVG’s leading lens molding and nanoimprint lithography (NIL) process equipment and DELO’s advanced adhesives and resist materials.
DELO has developed a particularly space-saving UV lamp for adhesive curing. The powerful DELOLUX 503 is designed for industrial applications requiring small surfaces to be bonded within seconds in serial production lines, for example for bonding cameras used in autonomous cars.
DELO has introduced a new, silicone-free liquid sealant for the automotive, electronics, and white goods industries. Curing by light, DELO PHOTOBOND SL4165 protects from dust, air, and water.
GUINNESS WORLD RECORDS® title awarded for 17,5-ton truck lifted one meter by crane on a bonded aluminum cylinder the size of a soft drink can.
DELO reported revenues of € 156 million (previous year: € 159 million) for the fiscal year ending on March 31. The adhesive manufacturer anticipates revenues in the region of € 170 million for the current year.
DELO has presented light fixation for two-component epoxy resins. Thanks to this hybrid chemistry, users benefit from faster, less complex production processes and simplified logistics.