DELO, Mühlbauer and Impinj, have announced a new milestone in the effort to achieve high-volume inlay manufacturing. The three RAIN RFID industry leaders have successfully teamed to deliver DELO MONOPOX AC6545, supporting the high-speed assembly of copper-bonded RFID chips such as the Impinj Monza 6 family on Mühlbauer high speed assembly lines.

The new, innovative adhesive is a key step forward on the “Path to 100k UPH”, manufacturing 100,000 RAIN RFID labels per hour on a single assembly line. Achieving this goal will empower inlay manufacturers to increase throughput and reduce operating costs, allowing RAIN RFID tagging to scale across high-volume industries such as apparel, retail, shipping, and airline baggage tracking.

Featuring an excellent adhesion to copper, DELO MONOPOX AC6545 enables the high-speed assembly of copper-plated chips such as the Impinj Monza 6 family. The solvent-free, anisotropic conductive adhesive (ACA) can be applied by innovative jetting technologies and also delivers improved performance with gold-bonded chips.

In addition to rapid dispensing, extremely quick curing is essential to support the fastest assembly speeds. This product allows for curing times as low as one second when using a thermode at 230 °C, making it one of the fastest products in DELO’s extensive portfolio of RAIN RFID adhesives. With higher temperatures, even shorter curing times can be achieved.

With these improved ACA curing times, Mühlbauer’s DDA (Direct Die Attach) can now produce over 40k UPH. For more than three years, customers have reliably operated DDA machines 24 hours a day, seven days a week. Going forward, the Mühlbauer roadmap includes increasing machine capacity to 100k UPH and full automation over the complete inlay production chain to improve the yield and reliability of the final assembly.