MEMS Packaging: DELO Makes Miniaturization Possible

Microelectromechanical systems (MEMS) can be found in many everyday products. The tiny components can be found in the form of sensors and actuators in various electronic devices.

The field of consumer electronics is booming and MEMS sensors that make electronic devices interactive and user-friendly have become utterly indispensible. Nowadays, a smartphone contains up to up to 20 chips that stabilize photos, help to determine the location, measure height, air pressure and acceleration, among many other things. They detect whether a device is being held horizontally or vertically, a function that is essential for the use of each and every touch panel.

Highly innovative products require suitable adhesives. DELO adhesives are certainly a match for rapid developments in the field of MEMS packaging, since they are characterized by a one-of-a-kind combination of flexibility and high bonding strength, are easy to handle, and enable the development of smaller and smaller microelectromechanical systems.