Press releases

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High-Temperature-Resistant Encapsulant for Electronic Components

DELO has developed an encapsulant with very high resistance to media and temperature. Thanks to an optimized curing time, DELO MONOPOX GE6515 also accelerates production processes. The product is particularly well suited for encapsulating electronic components in automotive applications. ...more

Highly Filled Adhesives Feature Good Dispensing Properties

Fillers in adhesives, potting compounds and encapsulants can lead to mechanical abrasion in dispensing systems. Despite such potentially abrasive behavior, the adhesives can be dispensed reliably and precisely over the long term. This is the result of experimental tests performed by ViscoTec and ...more

eLearning Program 2019: Webinars on Adhesive Bonding

DELO has published its new webinar program. After addressing basic topics, such as adhesive-friendly design, last year, the Webinars in 2019 will focus on areas such as structural bonding and e-mobility. ...more

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Matthias Stollberg

+49 8193 9900 - 212

press@DELO-adhesives.com

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